Exhibition Introduction

2023 Shenzhen International Semiconductor Packaging and Testing Technology Exhibition (CHTF), exhibition time: November 15th to November 19th, 2023, exhibition location: China-Shenzhen-Futian District Fuhua 3rd Road-Shenzhen Convention and Exhibition Center (Futian District) , Organizer: Shenzhen China International High-tech Achievements Trading Center, holding period: once a year, exhibition area: 142,000 square meters, exhibitors: 451,000 people, the number of exhibitors and participating brands reached 3,349.

Shenzhen International Semiconductor Packaging and Testing Technology Exhibition CHTF (Shenzhen Semiconductor Exhibition, Shenzhen Testing Exhibition, Semiconductor Exhibition), semiconductors are the source of rapid development of today's information technology industry, "Made in China 2025" puts the semiconductor industry on the development of a new generation of information technology industry leader. As the world's largest semiconductor consumer market, China's semiconductor industry is facing unprecedented development opportunities. only by seizing this time window can the global market structure be redefined. "2021 Shenzhen International Semiconductor Packaging and Testing Technology Conference and Exhibition, Shenzhen International Semiconductor Packaging and Testing Technology Exhibition" will be held on November 17-21, 2021 at the Shenzhen Convention and Exhibition Center. Powerful semiconductor industry event. Covers all aspects of semiconductor technology manufacturing, including equipment, design, lithography, integration, materials, processes, manufacturing, and emerging semiconductor technologies and silicon material applications. In addition, high-level representatives of major companies and industry experts gathered together to focus on hot topics in the industry and discuss and communicate on LED, semiconductor materials, and micro-electromechanical systems. For domestic and foreign manufacturers engaged in integrated circuit design, chip processing, packaging and testing, semiconductor special equipment, semiconductor special materials, and semiconductor discrete devices, enterprises and institutions have built a platform to display new achievements and build product brands. Moreover, focusing on the interpretation of industrial policies, the summit forums and seminars covering "institutional innovation, model innovation, technological innovation" and other content have excellent reputation and popularity in the industry.

Shenzhen International Semiconductor Packaging and Testing Technology Exhibition CHTF (Shenzhen Semiconductor Exhibition, Shenzhen Test Exhibition, Semiconductor Exhibition), as the world's largest and most influential annual event in the international semiconductor field, this exhibition will be "internationalized, specialized, high-tech According to the requirements of the meeting, Japan, South Korea, the United States, France, the United Kingdom, Germany, Finland and other European and American regions, as well as mainland China/Hong Kong and Taiwan semiconductor industry giants are invited to discuss and exchange the development of China's semiconductor industry. This year's Shenzhen International Semiconductor Packaging and Testing Technology Exhibition conforms to the trend of industrial development and serves more than a dozen emerging industry applications. Dozens of leading chip and semiconductor companies in emerging application fields such as AI, autonomous driving, Internet of Things, 5G communications, smart terminals, and smart sensing will be invited to demonstrate new solutions to promote the effective combination of the semiconductor industry and emerging application markets. Enterprise users visit and communicate, lead design, manufacturing, packaging and testing, materials and equipment manufacturers to carry out cooperation and dialogue, and create an excellent platform for close cooperation and communication between popular market segments and emerging application end customers, as well as the semiconductor industry chain.

"2021 Shenzhen International Semiconductor Packaging and Testing Technology Exhibition CHTF (Shenzhen Semiconductor Exhibition, Shenzhen Testing Exhibition, Semiconductor Exhibition), Shenzhen International Semiconductor Packaging and Testing Technology Exhibition CHTF (Shenzhen Semiconductor Exhibition, Shenzhen Testing Exhibition, Semiconductor Exhibition)" as the "2021 No. An important part of the 23rd China International Hi-Tech Fair (High-Tech Fair), in addition to its own traffic, it also shares high-tech exhibitions from artificial intelligence, smart home, smart manufacturing, Internet of Things, smart driving, and Internet of Vehicles , 5G commercial use, 8K ultra-high-definition, blockchain technology, next-generation information technology, big data, cloud computing, emergency safety, photoelectric display and other industry exhibitions, 451,000 visitors visited the conference within 5 days, strengthening the construction of the semiconductor industry industry chain, The rapid development of the industry and extensive exchanges and cooperation provide a strong cooperation platform.

Range of exhibition

IC design: IC and related electronic product design, IC products and application technology, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and hybrid Signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc.;

Wafer manufacturing and packaging: wafer manufacturing, SiP advanced packaging, OSATs, EMS, OEMs, IDM, silicon wafers and IC packaging substrates, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing , equipment and application manufacturing and packaging and testing, EDA, MCU, printed circuit boards, packaging substrate semiconductor materials and equipment, etc.;

Integrated circuit manufacturing: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits and digital-analog hybrid integrated circuit manufacturing, integrated circuit terminal products, etc.;

Semiconductor equipment manufacturing: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, dicing machine, placement machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, Lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment, CVD/PVD equipment, coating/developing machine, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single wafer deposition system , solid crystal machine, plasma cleaning equipment, cutting machine, chip loading machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, Other materials and electronic special equipment, coupling machine, carrier tape forming machine, testing equipment, constant temperature and humidity test chamber, sensor, packaging mold, test fixture, precision slide table, stepping motor, valve, probe station, clean room equipment , water treatment, etc.;

Packaging and testing support: test probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, wire bonding, welding test, automatic testing, laser cutting and others, grinding Fluid, dicing fluid, sealing film (glue) high temperature tape, laminated substrate, patch glue, feeding board, wire flow control, quartz graphite, silicon carbide, etc.;

Third-generation semiconductor: third-generation semiconductor silicon carbide SiC, gallium nitride GaN, wafer, substrate, packaging, testing, optoelectronic devices (light-emitting diode LED, laser LD, detector ultraviolet), power electronic devices (diode) MOSFET , JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave radio frequency devices (HEMT, MMIC), etc.;

Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, silicon germanium materials, S01 materials, silicon materials for solar cells and compound semiconductor materials, quartz products, graphite products, anti-static materials , photoresist and its supporting reagents, wafer tape, photomask, electronic gas, special chemical gas, CMP polishing material, packaging substrate, lead frame, bonding wire, encapsulation material, ceramic substrate, chip bonding material , photoresist materials, wet electronic chemicals, sputtering targets, packaging and testing materials, slicing, grinding, polishing, thin films, etc.;

Electronic components: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices/IGBT, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro Motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystals, quartz, ceramic magnetic materials, base substrates for printed circuits, special materials for electronic functional processes, electronic glue (tape) products, Electronic chemical materials and parts, passive devices, 5G core components Special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometers, magnetic components, filter components, PCB boards , Motor fans, electro-acoustic devices, display devices, diodes, triode filter components, switches and component materials and equipment, etc.;

Comprehensive: government groups from all over the country, high-tech industrial parks in semiconductor related fields, securities, banks, insurance, funds, investment and financial institutions, etc.

Pavilion information

Shenzhen Convention and Exhibition Center (Futian District) Shenzhen International Convention

Venue area: 105,000 square meters

Exhibition hall address: China - Shenzhen - Fuhua 3rd Road, Futian District